WAVE-Thru-Hole Assembly

Selective Solder Machine

ACE KISS 103 (1)
Board Size: Min. 2” x 2” Max. 24” x 18”
Heated N2
Lead and Lead-Free (exchangeable solder pots)
Top and bottom side preheaters
De-Bridging N2 Jet
Utilizes Water soluble and No clean fluxes
Fiducial correction system
Board wrap compensation system

Leaded Wave Solder Machine

Electrovert Electra (1)
Fluxer: Ultrasonic spray fluxer
Preheat: 3 convection preheat bottom, 1 IR preheat top
Wave: SMT chip wave section and Lambda for through-hole components
De-bridging: Accu-Knife hot air de-bridging tool
Board Size: Min. 2” x 2” Max. 20” x 18”
Standard solder: 63Sn/37Pb

Lead Free Wave Solder Machine

Technical Devices Nu/Era CV (1)
Fluxer: Ultrasonic spray fluxer
Preheat: 2 convection preheat bottom/top, 1 IR preheater
Wave: SMT chip wave section and Lambda for through-hole components
Board Size: Min. 2” x 2” Max. 20” x 18”
Standard solder: SAC305

Nitrogen Generator

On-Site Model N-50 (1)
Built in oxygen analyzer
Produces up to 226 SCFH at a purity of 99.99%
120 gallon storage capacity

Solder Fountain

(used to dip solder, pre tin, etc.)

Lead Solder
Hakko 485 (3) with automatic solder flow controller
Component size: 9.9mm x 9.9mm to 89mm x 10mm
Standard solder: 63Sn/37Pb

Lead Free Solder
Hakko 485 (2) with automatic solder flow controller
Component size: 9.9mm x 9.9mm to 89mm x 10mm
Standard solder: SAC 305

Lead forming

General Product Devices Model: CF8, Component former,
Hepco Inc, Model T3700-2 Lead trimmer