SMT Pick and Place

SMT

Board Size: Max: 31.8” x 19.2”
Min: 2” x 2” (without carrier)
Component range: 0.3015 to 54mm² and 45x100mm (BGA, µBGA, CSP, connector, odds).
Mounting Accuracy: @ 3 sigma .35 microns

SMT EQUIPMENT

Pick & Place Machines
Yamaha Placing equipment
YSM20 -1 1 head gantry with 5 pick-up nozzles
YSM20-2 2 head gantry with 20 pick-up nozzles
Feeder Capacity (each): 128 8mm smart feeders (note: total feeders available 354, various sizes)
cATS10 tray stacker: 10 tray capacity
Mfg. Max Placement Rate: 90K CPH
IPC 9850: 63.5K CPH
Board size: Min. 2” x 2” Max. 31.8” x 19.2”
Component range: 0.3015 to 54mm² and 45x100mm (BGA, µBGA, CSP, connector, odds).
Mounting Accuracy: @ 3 sigma .35 micron

The following SMT pick and place equipment is manufactured by “ASSEMBLEON” (Phillips)

Topaz-X2 FNC (5)

1 head gantry with 8 automatic exchange nozzles.
Nozzles: 71-74 and (76 for MELF parts).
(71 01005-0603, 72 0805-Tantalum case A, 73 Tantalum case B-SOIC, etc.).
Feeder Capacity: 80 8mm, 48 12-16mm, 32 24-32mm, 24 44mm, 18 56mmm.
Mfg. Max Rate: 20K CPH
IPC 9850: 15.4K CPH
Board Size: Min. 2” x 2” Max. 18.1” x 17.3”
Component range: (0201) (0402) to 45x100 mm (BGA, µBGA, CSP, connector, odds).
Mounting Accuracy: @ 3 sigma, 50 micron for chips, and 35 micron for QFPs.

MG1 (2)

1 head gantry with 8 automatic exchange nozzles.
Nozzles: 211-215 and 216 nozzles for MELF parts).
(211 01005-0402, 212 0603-Tantalum case A, 213 Tantalum case B-SOIC, etc.)
Feeder Capacity: 96 8mm, 48 12-16mm, 32 24-32mm, 24 44mm, 18 56mmm.
Mfg. Max Rate: 24K CPH
Real Time Rate: 17.4K CPH
Board Size: Min. 2” x 2” Max. 18.1” x 17.3”
Component range: 01005 (0402) to 45x100 mm (BGA, µBGA, CSP, connector, odds)..
Mounting Accuracy: @ 3 sigma, 50 micron for chips, and 30 micron for QFPs.

OPAL (1)

8 head gantry with 8 automatic exchange nozzles.
Nozzles: 71-74 and (76 for MELF parts).
(71 01005-0603, 72 0805-Tantalum case A, 73 Tantalum case B-SOIC, etc.).
Feeder Capacity: 96 8mm, 45 12-16mm, 28 24-32mm, 20 44mm, 12 56mm.
Mfg. Max Rate: 17.7k CPH
IPC 9850: 13.9k CPH
Board Size: Min. 2” x 2” Max. 18.1” x 17.3”
Component range: (0201) (0402) to 45x100 mm (BGA, µBGA, CSP, connector, odds).
Mounting Accuracy: @ 3 sigma, 50 micron for chips, and 35 micron for QFPs.

Solder Paste Printers:

DEK Horizon 02 (2)
Fully automatic with fiducial recognition, under stencil cleaning system, and paste on pad verification system.
Board Size: Min. 2” x 2” Max. 20” x 20”

DEK Horizon 02i (1)
Fully automatic with fiducial recognition, under stencil cleaning system, 25 micron +/- paste on pad verification system.
Board Size: Min. 2” x 2” Max. 20” x 20”

DEK Horizon 03iX (1)
Fully automatic with fiducial recognition, under stencil cleaning system, 25 micron +/- paste on pad verification system.
Board Size: Min. 2” x 2” Max. 20” x 20”

Yamaha YCP10
Fully automatic with fiducial recognition, under stencil auto cleaning system, .025 mm printing accuracy, .010mm repeatability
Board Size: Min. 2” x 2” Max. 20” x 20”

Solder Paste Inspection System

ASC International, SP3D, Mini (1)
Windows XP User Interface, Automatic Height/Width/Length/Area and Volume Calculations, Large, Anti-Static Work Surface, Class II Laser Source, High-Resolution Video Monitor, Solid State Video Camera, PC Control, SVGA Monitor.
1.6 in. maximum object thickness, 36 x 24 in. standard work surface, 16 in throat depth.

SMT Reflow Ovens: (4)

Vitronics Soltec XPM3 1240 with 12 convection heating (top & bottom) zones and EC2 4 cooling zones.
Temperature: Max. 350°C
Board size: Min. 2” Max. 20”

Heller 1913 MK III with 13 convection heating (top & bottom) zones, 3 cooling zones.
Temperature: Max. 300°C
Board Size: Min. 2” Max. 18”

Heller 1809 MKIII with 9 convection heating (top & bottom) zones, 2 cooling zones
Temperature: Max. 300°C
Board size: Min. 2” Max. 18”

Heller 1809 MK III with 9 convection heating (top & bottom) zones, 2 cooling zones.
Temperature: Max. 300°C
Board Size: Min. 2” Max. 18”

Baking Ovens:

Blue M Electric model SPX (1)
(Used to pre-bake PCB and selected components prior to SMT process)

TPS-Blue M, model ESP400 (2)
(Used to cure epoxies, potting compounds and preheat assemblies)

GRIEVE model TBH-500 200sq/ft chamber (1)
(Used to cure epoxies, potting compounds and preheat assemblies)

Yamato model DVS 602 (3)
(Used to cure epoxies, potting compounds, preheat assemblies)

JPW Industries model BT222SUL220V3KW
(used to cure PCBs that have a requirement for no contact with silicone products)