SMT
Board Size: Max: 31.8” x 19.2”
Min: 2” x 2” (without carrier)
Component range: 0.3015 to 54mm² and 45x100mm (BGA, µBGA, CSP, connector, odds).
Mounting Accuracy: @ 3 sigma .35 microns
SMT EQUIPMENT:
Pick & Place Machines
Hanwha Placing equipment
HM 520
Cutting-edge Modular Mounter
2 Gantry x 20, 6 Spindle/Gantry
Placement Speed: 80K CPH
Board Size: Max. 750 x 580
Component range: 0201~6mm/~55mm (H15mm)
Mounting Accuracy: ±25 μm @ Cpk ≥ 1.0/Chip, and ±30 μm @ Cpk ≥ 1.0/IC
Intelligent-ready electronic feeders
Bar code scan assist
SM 481 Plus (4)
Advanced High Speed Flexible Mounter
10 spindle single overhead gantry; megapixel full vision alignment and centering
Placement Speed: 32K CPH (IPC9850)
Board Size: Max. 18.11” x 15.74”
Component range: 0402 to 16mm (01005 to .65”), H10mm (.39”)
Mounting Accuracy: 40 microns/chip, 30 microns/QFP
Intelligent-ready electronic feeders
Bar code scan assist
SM 482 Plus (3)
Advanced High Speed Flexible Mounter
6 spindle single overhead gantry; megapixel full vision alignment and centering
Placement Speed: 22K CPH (IPC9850)
Board Size: Max. 18.11” x 15.74”
Component range: 0402 to 16mm (01005 to .65”), H10mm (.39”)
Mounting Accuracy: 40 microns/chip, 30 microns/QFP
Intelligent-ready electronic feeders
Bar code scan assist
SM 485
Advanced High Speed Flexible Mounter
5 spindle single overhead gantry; megapixel full vision alignment and centering
Placement Speed: 22K CPH (IPC9850)
Board Size: Max. 18.11” x 15.74”
Component range: 0402 to 16mm (01005 to .65”), H10mm (.39”)
Mounting Accuracy: 40 microns/chip, 30 microns/QFP
Custom component gripper ANC with auto nozzle changer (to place specialty designed components such as custom connectors)
Intelligent-ready electronic feeders
Bar code scan assist.
STF-100S (4)
Side Tray Feeder
20 JEDEC tray capacity. For all tray components such as BGA’s, QFP etc.
Non-stop operation
Solder Paste Printers:
ESE US-2000X (2)
Fully automatic with 3 camera fiducial recognition, under stencil cleaning system and 2D paste verification system.
Board Size: Min. 2” x 2” Max. 21” x 16”
DEK Horizon 03iX (1)
Fully automatic with fiducial recognition, under stencil cleaning system, 25 micron +/- paste on pad verification system.
Board Size: Min. 2” x 2” Max. 20” x 20”
Yamaha YCP10
Fully automatic with fiducial recognition, under stencil auto cleaning system, .025 mm printing accuracy, .010mm repeatability
Board Size: Min. 2” x 2” Max. 20” x 20”
Solder Paste Inspection System
ASC International, SP3D, Mini (1)
Automatic Height/Width/Length/Area and Volume Calculations, Large, Anti-Static Work Surface, Class II Laser Source, High-Resolution Video Monitor, Solid State Video Camera, PC Control, SVGA Monitor.
1.6 in. maximum object thickness, 36 x 24 in. standard work surface, 16 in throat depth.
SMT Reflow Ovens: (4)
Vitronics Soltec XPM3 1240 with 12 convection heating (top & bottom) zones and EC2 4 cooling zones.
Temperature: Max. 350°C
Board size: Min. 2” Max. 20”
Heller 1913 MK III with 13 convection heating (top & bottom) zones, 3 cooling zones.
Temperature: Max. 300°C
Board Size: Min. 2” Max. 18”
Heller 1809 MKIII with 9 convection heating (top & bottom) zones, 2 cooling zones
Temperature: Max. 300°C
Board size: Min. 2” Max. 18”
Heller 1809 MK III with 9 convection heating (top & bottom) zones, 2 cooling zones.
Temperature: Max. 300°C
Board Size: Min. 2” Max. 18”
Baking Ovens:
Blue M Electric model SPX (1)
(Used to pre-bake PCB and selected components prior to SMT process)
TPS-Blue M, model ESP400 (2)
(Used to cure epoxies, potting compounds and preheat assemblies)
GRIEVE model TBH-500 200sq/ft chamber (1)
(Used to cure epoxies, potting compounds and preheat assemblies)
Yamato model DVS 602 (3)
(Used to cure epoxies, potting compounds, preheat assemblies)
JPW Industries model BT222SUL220V3KW
(used to cure PCBs that have a requirement for no contact with silicone products)